发明名称 ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To cool a heating card by supplying the air on the outside of a housing, being fed by means of a fan, to the heating card while adjusting to an appropriate flow rate, and while suppressing dew condensation caused by environmental change on the outside of a housing, by a simple configuration.SOLUTION: A heating card 170 is configured so that the air on the outside of a housing 100 can be supplied to an electronic component 173, when a board mounting the electronic component 173 is housed, and mounted on a card slot 121. A blank card 180 has a movable shield plate 185 for shielding the air on the outside of a housing, when mounted on the card slot while housing a board not mounting an electronic component. A shield plate moving section 188 moves the movable shield plate 185 so that the air on the outside of a housing 100, being fed to the card slot 121 by means of the fan 111, passes through the blank card 180, based on the temperature in the housing 100, and the dew-point temperature in the housing 100.
申请公布号 JP2015220412(A) 申请公布日期 2015.12.07
申请号 JP20140104645 申请日期 2014.05.20
申请人 NEC CORP 发明人 HATTORI TAKESHI
分类号 H05K7/20 主分类号 H05K7/20
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