| 摘要 |
PROBLEM TO BE SOLVED: To provide a support plate that enables a wafer from being easily peeled off and also can make neither starch nor adhesive agent be left on the surface of a device.SOLUTION: The surface of a wafer having a device area having plural devices formed thereon and an outer peripheral extra area surrounding the device area is adhesively attached to a support plate. The support plate has a base plate having a recess portion formed on a surface area of the support plate which corresponds to the device area of the attached wafer, and an annular groove formed in an area corresponding to the outer peripheral extra area of the wafer, and a flexible member filled in the recess portion of the base plate. By injecting adhesive agent into the annular groove, the wafer is adhesively attached to the surface of the support plate through the adhesive agent. |
