| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrical contact member in which the influence of impurities caused at the anode upon plating can be eliminated, a plating method and a plating device.SOLUTION: A plating liquid 12 flows in one direction by being made to flow one side 11a to a plating tank 11 and being made to flow to the other side 11b. Further, a cathode 13 is arranged so as to be located to the upstream side than an anode 14 to the flow direction of the plating liquid. Then, a potential difference is generated between both the poles 13, 14 by an external power source 15 to precipitate a metal melted in the plating liquid 12 over the surface of the cathode 13 to produce an electrical contact member 30. |
