发明名称 |
CIRCUIT BOARD, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CIRCUIT BOARD |
摘要 |
Disclosed is a circuit board, wherein a connection pad for a connection with an external device is formed to protrude on an upper surface of an outmost insulation layer. A device can be mounted on the circuit board, and a connection terminal of the device and the connection pad of the circuit board can be connected by a wire or the like. |
申请公布号 |
KR20150135896(A) |
申请公布日期 |
2015.12.04 |
申请号 |
KR20140063045 |
申请日期 |
2014.05.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG, MYUNG SAM;SUNG, KI JUNG;KOOK, SEUNG YEOP;LEE, SEUNG EUN |
分类号 |
H05K1/18;H05K3/32 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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