APPARATUS FOR INSPECTING A WAFER

摘要

The present invention relates to a wafer inspecting apparatus for performing inspection of a wafer attached on a dicing tape attached on a mount frame and comprising a plurality of dies. The apparatus comprises: a rod port for supporting a cassette storing the wafer; a wafer chuck for supporting the wafer; a wafer transfer unit for transferring the wafer in a horizontal direction between the cassette and the wafer chuck; an inspection unit for inspecting the wafer supported on the wafer; and a guide rail disposed adjacent to the rod port and being extended in the horizontal direction, between the cassette and the wafer chuck, to guide the wafer.