| 摘要 |
The present invention provides an apparatus for processing a substrate. The apparatus for processing a substrate comprises: a chamber; a conveying unit disposed in the chamber, and conveying a substrate along a first direction; a housing disposed in the chamber, and providing a first space of which a lower portion is opened; and a spraying member disposed in the housing, and spraying a first fluid to a substrate. A first exhaust pipe installed with a first decompression member is coupled to the first space, and a second exhaust pipe installed with a second decompression member is coupled to a second space between the housing and the chamber. In addition, the present invention provides a method for processing a substrate. When the first fluid is sprayed by the spraying member, the first decompression member and the second decompression member provide, to the first space, negative pressure greater than that of the second space. |
