| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of suppressing occurrence of a void that affects reliability in a boundary face between an adherend and a sheet-like resin composition, and capable of manufacturing a highly reliable semiconductor device.SOLUTION: A thermosetting sheet-like resin composition is for filling a space between an adherend and a semiconductor element electrically connected to the adherend. When viscosity of the sheet-like resin composition is measured under a measurement condition at a temperature range of 50°C-250°C, a rate of temperature rise 10°C/min, and a frequency of 1 Hz, viscosity &eegr;at a temperature of 150°C is 0.05 MPa.s≤&eegr;≤2.2 MPa.s, and viscosity &eegr;at a temperature of 200°C is 1.0 MPa.s≤&eegr;≤100.0 MPa.s. |
