LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND LEAD FRAME FOR MOUNTING SEMICONDUCTOR ELEMENTS

摘要

A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

主权项

1. A lead frame for mounting LED elements, comprising:
a frame body region; and a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a cutting region; wherein the die pad and lead section in a package region of interest are connected to the die pad and lead section, respectively, in a second package region adjacent to the package region of interest, by a die pad connecting portion and a lead connecting portion, respectively; wherein the die pad connecting portion and lead connecting portion are connected to each other by a reinforcement piece positioned in the cutting region; and wherein the reinforcement piece extends only between the lead connecting portion and the die pad connecting portion.