发明名称 CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To highly accurately form a groove of a prescribed depth from a top face of a substrate in a workpiece having a laminate formed on the substrate.SOLUTION: A cutting method includes: a cutting mark formation step for allowing a cutting blade 42 having a prescribed outer diameter and rotating to cut at a depth from a laminate 12 side to a substrate 11 and forming a cutting mark 16 elongating in a length direction orthogonal to a thickness direction of the cutting blade 42 and having a substrate cutting mark 18 exposed in a laminate cutting mark 17 in a workpiece 10; a cutting depth calculation step for calculating a cutting depth of the cutting blade 42 into the substrate 11 on the basis of a distance L in the length direction of the substrate cutting mark 18 and the outer diameter of the cutting blade 42; and a cutting step for adjusting a tip height of the cutting blade 42 on the basis of the cutting depth into the substrate 11, positioning the cutting blade 42 so as to have a prescribed cutting depth in relation to the substrate 11 and cutting the workpiece 10.
申请公布号 JP2015214002(A) 申请公布日期 2015.12.03
申请号 JP20140099386 申请日期 2014.05.13
申请人 DISCO ABRASIVE SYST LTD 发明人 TANAKA HIDEAKI;KAMIGAKI MASAYOSHI
分类号 B24B27/06;H01L21/301 主分类号 B24B27/06
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