| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package that is enhanced in solder lifetime.SOLUTION: A semiconductor package 10 has a semiconductor chip, a housing member 16 which is configured to accommodate the semiconductor chip therein so that the confront face 34 thereof to a board is rectangular, and plural terminals 18 for external connection which are formed on the confronting face to electrically connect the semiconductor chip to the board and soldered to the board. Each terminal is provided to extend inwards from one of the four sides 36a, 36b, 36c, 36d of the peripheral edge 36 of the confronting face, and the terminals are arranged on the respective sides. When the direction along one of two confronting sides is defined as X-direction and the direction along the other side is defined by Y-direction, all the terminals arranged on one of any two adjacent sides extend so that at least some of the terminals confront the terminals arranged on the other side in at least one of the X-direction and the Y-direction. |
