| 摘要 |
PROBLEM TO BE SOLVED: To provide a beam lead for power module in which a solder layer between a beam lead and a semiconductor element is less susceptible to impairment due to thermal stress.SOLUTION: A beam lead 3 is bonded to a first semiconductor element 11 and a second semiconductor element 13 mounted on a substrate 5, and a second electrode pattern 9. Enlarged diameter parts 17, 31 are formed by spreading the end of a cylindrical body 15 radially outward, and set as solder joints to the semiconductor elements 11, 13. |
