PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

摘要

A package structure is provided, which includes: a substrate having opposite top and bottom surfaces and a plurality of conductive pads and a plurality of conductive posts formed therein, wherein the conductive pads are exposed from the bottom surface of the substrate, and the conductive posts are electrically connected to the conductive pads and each of the conductive posts has an end surface exposed from the top surface of the substrate; a plurality of first conductive bumps formed on the end surfaces of the conductive posts; a plurality of second conductive bumps formed on the top surface of the substrate, wherein the second conductive bumps are higher than the first conductive bumps; and at least a first electronic element disposed on and electrically connected to the first conductive bumps, thereby increasing the wiring flexibility and facilitating subsequent disposing of electronic elements without changing existing machines.

主权项

1. A method for fabricating a package structure, comprising the steps of:
providing a substrate having opposite top and bottom surfaces, wherein the substrate has a plurality of conductive pads and a plurality of conductive posts formed therein, the conductive pads are exposed from the bottom surface of the substrate and the conductive posts are electrically connected to the conductive pads and exposed from the top surface of the substrate; forming a conductive layer on the top surface of the substrate; forming a plurality of first conductive bumps and a plurality of second conductive bumps on the conductive layer, wherein the second conductive bumps are higher than the first conductive bumps; removing the conductive layer exposed from the first conductive bumps and the second conductive bumps; and disposing and electrically connecting at least a first electronic element to the first conductive bumps.