| 摘要 |
A fluid handling device includes a substrate, a film, and a conductive layer. The substrate includes a first through-hole, and a second through-hole. The conductive layer is disposed on one surface of the film to extend in a first area, a second area and a third area of the film. The substrate includes a first surface and a second surface facing away from the first surface. The first area is bonded to the first surface of the substrate such that a housing part is formed by closing one opening of the first through-hole, and such that a part of the conductive layer is exposed to the inside of the housing part. The second area is disposed inside the second through-hole, and the third area is bonded to the second surface of the substrate such that a part of the conductive layer is exposed to the outside. |
| 主权项 |
1. A fluid handling device comprising:
a substrate including a first through-hole or a recess, and a second through-hole; a film including a first area, a second area disposed adjacent to the first area, and a third area disposed adjacent to the second area; and a conductive layer disposed on one surface of the film to extend in the first area, the second area and the third area to conduct electricity or heat, wherein: the substrate includes a first surface and a second surface facing away from the first surface, the first area of the film is bonded to the first surface of the substrate such that a housing part capable of housing liquid is formed by closing one opening of the first through-hole or an opening of the recess, and such that a part of the conductive layer is exposed to an inside of the housing part, the second area of the film is disposed inside the second through-hole, and the third area of the film is bonded to the second surface of the substrate such that a part of the conductive layer is exposed to an outside. |
