Process for Forming Package-on-Package Structures

摘要

A device includes an inter-layer dielectric, a device die under the inter-layer dielectric; and a die-attach film under the inter-layer dielectric and over the device die, wherein the die-attach film is attached to the device die. A plurality of redistribution lines includes portions level with the die-attach film. A plurality of Z-interconnects is electronically coupled to the device die and the plurality of redistribution lines. A polymer-comprising material is under the inter-layer dielectric. The device die, the die-attach film, and the plurality of Z-interconnects are disposed in the polymer-comprising material.

主权项

1. A method comprising:
forming a first plurality of redistribution lines; forming first Z-interconnects over and electrically coupled to the first plurality of redistribution lines; attaching a first device die, wherein a portion of the first device die is substantially coplanar with a portion of the first Z-interconnects; after the forming the first Z-interconnects, encapsulating the first device die and the first Z-interconnects in a first encapsulation material; and forming a second plurality of redistribution lines electrically coupling to the first device die, wherein the first plurality of redistribution lines and the second plurality of redistribution lines are on opposite sides of the first Z-interconnects.