| 发明名称 |
CHIP ON FILM AND DISPLAY APPARATUS |
| 摘要 |
The present disclosure of the present invention provides a chip on film and a display apparatus. The chip on film comprises a substrate having an input end lead and an output end lead, a region where the input end lead is located and a region where the output end lead is located are defined as a binding region, wherein the maximum thickness of the binding region is larger than the maximum thickness of other parts of the substrate than the binding region. |
| 申请公布号 |
US2015348896(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201414518066 |
申请日期 |
2014.10.20 |
| 申请人 |
BOE Technology Group Co., Ltd. |
发明人 |
LI Shou;Wang Hong;Gyu Jung Chul |
| 分类号 |
H01L23/498;H01L23/00 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip on film, comprising a substrate having an input end lead and an output end lead, a region where the input end lead is located and a region where the output end lead is located are defined as a binding region, wherein the maximum thickness of the binding region is larger than the maximum thickness of other parts of the substrate than the binding region. |
| 地址 |
Beijing CN |
