发明名称 ELECTROSTATIC CHUCK WITH EMBOSSED TOP PLATE AND COOLING CHANNELS
摘要 An electrostatic chuck for retaining a substrate is provided herein. In some embodiments, an electrostatic chuck for retaining a substrate may include a susceptor including an electrically conductive susceptor base having one or more cooling channels formed in an upper surface thereof; a raised central support disposed over the one or more cooling channels; and a dielectric top plate disposed on the raised central support, wherein the dielectric top plate has an embossed top surface, and wherein the dielectric top plate and raised central support include a plurality of holes to facilitate delivery of a cooling gas one or more cooling channels to a backside of the substrate when disposed on the embossed top surface of the dielectric top plate.
申请公布号 US2015348813(A1) 申请公布日期 2015.12.03
申请号 US201514696747 申请日期 2015.04.27
申请人 APPLIED MATERIALS, INC. 发明人 MANGALORE CHETHAN;BALAN ARUMUGA;OH JEONGHOON
分类号 H01L21/683;H05B6/10;H01L21/687 主分类号 H01L21/683
代理机构 代理人
主权项 1. An electrostatic chuck for retaining a substrate, comprising: a susceptor including: an electrically conductive susceptor base having one or more cooling channels formed in an upper surface thereof;a raised central support disposed over the one or more cooling channels; anda dielectric top plate disposed on the raised central support, wherein the dielectric top plate has an embossed top surface, and wherein the dielectric top plate and raised central support include a plurality of holes to facilitate delivery of a cooling gas one or more cooling channels to a backside of the substrate when disposed on the embossed top surface of the dielectric top plate.
地址 Santa Clara CA US