| 摘要 |
The purpose of the present invention is to provide a method for manufacturing an electronic component in which a wafer, to which groove-shaped machining has been applied, and a porous member are bonded by an adhesive, wherein the grooves formed in the wafer can be sufficiently filled by the adhesive. A method for manufacturing an electronic component (1) provided with a magnetic substrate (120) and a semiconductor wafer (125) in which grooves are provided on at least one of the main surfaces, one of the main surfaces of the semiconductor wafer (125) and one of the surfaces of the magnetic substrate (120) being bonded by a resin layer (135). The method for manufacturing the electronic component (1) is provided with a coating step for applying a coating resin (120a) on one of the surfaces of the magnetic substrate (120), and a bonding step for bonding, after the coating step, one of the main surfaces of the semiconductor wafer (125) and the surface of the magnetic substrate (120) to which the coating resin has been applied. |
