LOW CTE COMPONENT WITH WIRE BOND INTERCONNECTS

摘要

A component such as an interposer or microelectronic element can be fabricated with a set of vertically extending interconnects of wire bond structure. Such method may include forming a structure having wire bonds extending in an axial direction within one of more openings in an element and each wire bond spaced at least partially apart from a wall of the opening within which it extends, the element consisting essentially of a material having a coefficient of thermal expansion (“CTE”) of less than 10 parts per million per degree Celsius (“ppm/° C.”). First contacts can then be provided at a first surface of the component and second contacts provided at a second surface of the component facing in a direction opposite from the first surface, the first contacts electrically coupled with the second contacts through the wire bonds.

主权项

1. A method of fabricating a component, comprising:
forming a structure including a plurality of wire bonds each extending in an axial direction within an opening of one or more openings in an element and each wire bond spaced at least partially apart from a wall of the opening within which it extends, the element consisting essentially of a material having a coefficient of thermal expansion (“CTE”) of less than 10 parts per million per degree Celsius (“ppm/° C.”); the structure having first contacts at a first surface of the component and second contacts at a second surface of the component facing in a direction opposite from the first surface, the first contacts being first ends of the wire bonds or the first contacts being coupled to first ends of the wire bonds, and the second contacts electrically coupled with the wire bonds.