HEAT SEAL COATING FOR USE ON SUBSTRATES

摘要

Heat seal coatings including an aqueous dispersion having a mixture of a polyamide and a copolymer of ethylene and acrylic acid are provided for use on a variety of substrates. In various embodiments, the aqueous dispersion is substantially free of non-aqueous plasticizers and organic solvents. Also provided is a method of heat sealing substrates, the method including applying an aqueous dispersion to a first substrate, drying the aqueous dispersion on the first substrate to form a coating on the first substrate, and heat sealing the first substrate to a second substrate at a temperature ranging from about 75° C. to about 140° C. The disclosure also describes a substrate coated with a heat sealed layer including a mixture of polyamide and a copolymer of ethylene and acrylic acid.

主权项

1. A coating for providing heat sealability to a substrate comprising:
an aqueous dispersion comprising a mixture of a polyamide and a copolymer of ethylene and acrylic acid; wherein the aqueous dispersion is substantially free of non-aqueous plasticizers and organic solvents.