发明名称 ELECTRON BEAM DRAWING APPARATUS AND ELECTRON BEAM DRAWING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electron beam drawing apparatus and electron beam drawing method capable of improving drawing throughput.SOLUTION: An electron beam drawing apparatus 100 comprises: a first aperture 203 for molding an electron beam emitted from an electron gun 201; a second aperture 206 on which an electron beam having an aperture image passing through the first aperture 203 is projected; and a first molding deflector 220 and a second molding deflector 222 that are individually provided between the first aperture 203 and the second aperture 206 and determine a shot shape and shot size by deflecting the electron beam to control an irradiation position of the aperture image on the second aperture 206. The first molding deflector 220 deflects the electron beam so that the aperture image is positioned at a position determined depending on the shot shape and shot size and the second molding deflector 222 deflects the electron beam deflected by the first molding deflector 220 to control of forming a desired shot size.
申请公布号 JP2015216321(A) 申请公布日期 2015.12.03
申请号 JP20140099725 申请日期 2014.05.13
申请人 NUFLARE TECHNOLOGY INC 发明人 MATSUI HIDEKI
分类号 H01L21/027;H01J37/305 主分类号 H01L21/027
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