| 发明名称 |
ELECTRONIC DEVICE PACKAGE |
| 摘要 |
An electronic device package may include a package body, an electronic device, and at least one conductive via. The package body includes a first surface and a second surface opposite to the first surface. The electronic device is disposed on the first surface. The at least one conductive via extends through the package body and includes a first end located in a mounting region of the first surface corresponding to a region on which the electronic device is disposed. The first end may have a first dimension measured along a first direction greater than a second dimension measured along a second direction substantially perpendicular to the first direction. |
| 申请公布号 |
US2015348906(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201414581221 |
申请日期 |
2014.12.23 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK Jong Kil;SON Min Young |
| 分类号 |
H01L23/522;H01L23/528 |
主分类号 |
H01L23/522 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device package, comprising:
a package body including a first surface and a second surface opposite to the first surface; an electronic device disposed on the first surface; and at least one conductive via extending through the package body and including a first end located in a mounting region of the first surface corresponding to a region on which the electronic device is disposed, wherein the first end has a first dimension measured along a first direction greater than a second dimension measured along a second direction substantially perpendicular to the first direction. |
| 地址 |
SUWON-SI KR |
