发明名称 SEMICONDUCTOR LIGHT EMITTING DEVICE AND WAFER
摘要 According to one embodiment, a semiconductor light emitting device includes: a foundation layer, a first semiconductor layer, a light emitting part, and a second semiconductor layer. The foundation layer includes a nitride semiconductor. The foundation layer has a dislocation density not more than 5×108 cm−2. The first semiconductor layer of a first conductivity type is provided on the foundation layer and includes a nitride semiconductor. The light emitting part is provided on the first semiconductor layer. The light emitting part includes: a plurality of barrier layers; and a well layer provided between the barrier layers. The well layer has a bandgap energy smaller than a bandgap energy of the barrier layers and has a thickness larger than a thickness of the barrier layers. The second semiconductor layer of a second conductivity type different from the first conductivity type, is provided on the light emitting part and includes a nitride semiconductor.
申请公布号 US2015349199(A1) 申请公布日期 2015.12.03
申请号 US201514824821 申请日期 2015.08.12
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 TACHIBANA Koichi;KIMURA Shigeya;NAGO Hajime;NUNOUE Shinya
分类号 H01L33/06;H01L33/22;H01L33/02;H01L33/32 主分类号 H01L33/06
代理机构 代理人
主权项 1. (canceled)
地址 Minato-ku JP