| 发明名称 |
METHOD OF MANUFACTURING MICROSTRUCTURES OF METAL LINES |
| 摘要 |
A method of manufacturing a metal line microstructure is provided. Firstly, a substrate is provided. Then, a seed layer is formed on a surface of the substrate. Then, a photoresist layer is formed on a surface of the seed layer, and a photolithography and etching process is performed to form a trench in the photoresist layer, wherein the trench has a specified width. Then, an electroplating process is performed to fill a conductive layer into the trench. Afterwards, the photoresist layer and a portion of the seed layer uncovered by the conductive layer are removed, so that the metal line microstructure is produced. |
| 申请公布号 |
US2015345042(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201414329009 |
申请日期 |
2014.07.11 |
| 申请人 |
JTOUCH Corporation |
发明人 |
Yeh Yu-Chou;Hu Chih-Ming;Tsui Chiu-Cheng |
| 分类号 |
C25D5/02;C25D5/34;C25D5/48;C23F1/02 |
主分类号 |
C25D5/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a metal line microstructure, the method comprising steps of:
(a) providing a substrate; (b) forming a seed layer on a surface of the substrate; (c) forming a photoresist layer on a surface of the seed layer, and performing a photolithography and etching process to form a trench in the photoresist layer, wherein the trench has a specified width; (d) performing an electroplating process to fill a conductive layer into the trench; and (e) removing the photoresist layer and a portion of the seed layer uncovered by the conductive layer, so that the metal line microstructure is produced. |
| 地址 |
Jhongli City TW |
