| 摘要 |
An embodiment of the present invention relates to solving a problem of impedance matching. As is implemented in connection with one or more embodiments, an apparatus comprises an integrated circuit including a signal connection terminal and processing circuitry passing signals along a communications path which is within an IC chip and connected to the signal connection terminal. Impedance matching circuitry operates to provide impedance matching for the communications path for mitigating signal loss due to impedance-mismatching. A chip-mounting structure secures the IC chip, and electrically connects to the IC chip at the signal connection terminal. |
