Resistance temperature sensors powered using reader bond pad sharing

摘要

A head transducer comprises a reader coupled to reader bond pads and configured to interact with a magnetic storage medium. A first thermal sensor is configured to produce a first sensor signal. The first sensor is biased relative to a common mode voltage at the reader bond pads. A second thermal sensor is configured to produce a second sensor signal. One of the first and second sensors is situated at or near a close point of the head transducer in relation to the magnetic storage medium, and the other of the first and second sensors spaced away from the close point. Circuitry is configured to combine the first and second sensor signals and produce a combined sensor signal indicative of one or both of a change in head-medium spacing and head-medium contact.

主权项

1. An apparatus, comprising:
a head transducer comprising a reader connected to reader bond pads and configured to interact with a magnetic storage medium; a sensor connected to the reader bond pads and configured to produce a sensor signal; and biasing circuitry coupled to the reader and the sensor, the biasing circuitry configured to alternately bias the reader and the sensor for reading and temperature sensing operations, respectively.