Capacitance touch panel module and fabrication method thereof

摘要

A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

主权项

1. A capacitance touch panel, comprising:
a substrate comprising a touching area and a peripheral area, wherein the peripheral area is around the touching area; a plurality of insulated protrusions in the touching area; an insulated frame corresponding to the peripheral area; a plurality of first conductive patterns arranged in a plurality of rows along a first orientation; a plurality of second conductive patterns arranged in a plurality of columns along a second orientation, wherein the second conductive patterns are electrically insulated from the first conductive patterns; and a plurality of connecting portions, wherein each connecting portion connects two neighboring first conductive patterns arranged in a row; a plurality of bridging members, wherein each bridging member connects two neighboring second conductive patterns in a column; and an overlapping region, wherein the overlapping region is the area that one of the connecting portions overlaps one of the insulated protrusions; wherein one of the insulated protrusions has a curved surface, and covers one of the connecting portions; and wherein one of the bridging members along the second orientation is longer than the overlapping region along the first orientation.