| 发明名称 | LED package structure including dark-colored and light-transmissible encapsulant | ||
| 摘要 | An LED package structure includes: an insulating substrate that has a front bonding pad assembly; a dark-colored die-attach adhesive; blue and green LED chips mounted on the front bonding pad assembly via the dark-colored die-attach adhesive; and a dark-colored and light-transmissible encapsulant that is disposed on the insulating substrate and that encapsulates the blue and green LED chips. The encapsulant has a light transmittance that ranges from 7% to 28% for the blue light and has a light transmittance that ranges from 9% to 30% for the green light. | ||
| 申请公布号 | US9202805(B2) | 申请公布日期 | 2015.12.01 |
| 申请号 | US201514590263 | 申请日期 | 2015.01.06 |
| 申请人 | Lite-On Opto Technology (Changzhou) Co., Ltd.;Lite-On Technology Corp. | 发明人 | Lee Hou-Te;Ying Tsung-Kang;Hsu Erh-Chan |
| 分类号 | H01L33/56;H01L25/075;H01L33/48;H01L33/54;H01L33/58;H01L33/62 | 主分类号 | H01L33/56 |
| 代理机构 | Rosenberg, Klein & Lee | 代理人 | Rosenberg, Klein & Lee |
| 主权项 | 1. An LED package structure, comprising: an insulating substrate that has a front bonding pad assembly formed thereon; a dark-colored die-attach adhesive; a blue LED chip emitting a blue light and being mounted on said front bonding pad assembly via said dark-colored die-attach adhesive; a green LED chip emitting a green light and being mounted on said front bonding pad assembly via said dark-colored die-attach adhesive; and a dark-colored and light-transmissible encapsulant that is disposed on said insulating substrate and that encapsulates said blue LED chip and said green LED chip, said encapsulant having a light transmittance that ranges from 7% to 28% for said blue light and having a light transmittance that ranges from 9% to 30% for said green light. | ||
| 地址 | Jiangsu Province CN | ||