Inspection apparatus for semiconductor device

摘要

Disclosed is an inspection apparatus for a semiconductor device, which is to inspect an electric characteristic of an inspective object having a plurality of electric inspective contact points. The inspection apparatus includes a socket assembly which includes a plurality of probe pins retractable in a longitudinal direction, a probe pin supporter supporting the probe pins in parallel with each other, and a socket board including a plurality of fixed contact points a first end portion of the probe pins, and an inspective object carrier which includes an inspective object accommodating portion accommodating the inspective object so that the inspective contact points face toward a second end portion of the probe pins, and a floor member interposed between the inspective object and the probe pin supporter and including probe holes penetrated corresponding to the inspective contact points and passing the second end portion of the probe pin therethrough.

主权项

1. An inspection apparatus for a semiconductor device, which is to inspect an electric characteristic of an inspective object having a plurality of electric inspective contact points, the inspection apparatus comprising:
a socket assembly which comprises a plurality of probe pins retractable in a longitudinal direction, a probe pin supporter supporting the probe pins in parallel with each other, and a socket board comprising a plurality of fixed contact points a first end portion of the probe pins; and an inspective object carrier which comprises an inspective object accommodating portion accommodating the inspective object so that the plurality of inspective contact points face toward a second end portion of the plurality of probe pins, and a floor member interposing between the inspective object and the probe pin supporter and totally covering lower of the inspective object accommodating portion, wherein the floor member comprising comprises probe holes penetrated corresponding to the inspective contact points and passing the second end portion of the probe pin therethrough, wherein the floor member and the probe pin supporter comprise an alignment member to align the probe pins with probe holes, wherein upon testing, the probe pins are aligned with probe holes.