Thin substrate and mold compound handling using an electrostatic-chucking carrier

摘要

Thin substrates and mold compound handling is described using an electrostatic-chucking carrier. In one example, a first part of a plurality of silicon chip packages is formed on a front side of a silicon substrate wafer at a first processing station. An a carrier wafer of an electrostatic chuck is attached over the front side of the silicon wafer. The substrate wafer is moved to a second processing station. A second part of the plurality of silicon chip packages are formed on a back side of the silicon wafer at a second processing station. The electrostatic chuck is then released.

主权项

1. A method comprising:
forming a first part of each of a plurality of silicon chip packages on a front side of a silicon substrate wafer at a first processing station; attaching a carrier wafer of an electrostatic chuck over the front side of the silicon wafer; moving the substrate wafer to a second processing station; forming a second part of each of the plurality of silicon chip packages on a back side of the silicon wafer at a second processing station; and releasing the electrostatic chuck.