| 摘要 |
A semiconductor device includes a functional block unit, external terminals and, and an external resin sealing body. The functional block unit includes an internal resin sealing body having an edge and an opposite edge. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The external resin sealing body covers the root portion and a portion of the middle portion of the external terminal, but does not cover the terminal portion of the external terminal. The functional block unit and the external terminals and are integrally connected together and sealed by the external resin sealing body. |
| 主权项 |
1. A semiconductor device comprising:
a functional block unit including a semiconductor element, at least one internal terminal having a first end and a second end and electrically connected to the semiconductor element, and an internal resin sealing body covering the semiconductor element and the first end of the at least one internal terminal but not covering the second end of the at least one internal terminal, wherein the internal resin sealing body has an upper surface facing in a first direction, an opposite lower surface, and an edge extending between the upper and lower surfaces; at least one external terminal having a third end connected to the second end of the at least one internal terminal, and a fourth end; and an external resin sealing body covering the second end of the at least one internal terminal and the third end of the at least one external terminal, but not covering the fourth end of the at least one external terminal; wherein a root portion located at the third end of the at least one external terminal has a first surface facing toward the internal resin sealing body, an opposite second surface, and a projection extending from the first surface, and the first surface of the root portion is in direct contact with the edge of the internal resin sealing body, and the projection of the root portion is in direct contact with the upper surface of the internal resin sealing body. |
