| 发明名称 |
SEMICONDUCTOR DIE SINGULATION METHOD |
| 摘要 |
The present invention relates to a semiconductor die singulation method. In one embodiment, semiconductor die are singulated from a semiconductor wafer by etching openings completely through the semiconductor wafer. |
| 申请公布号 |
HK1158825(A1) |
申请公布日期 |
2015.11.27 |
| 申请号 |
HK20110113167 |
申请日期 |
2011.12.06 |
| 申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES LLC |
发明人 |
GORDON M. GRIVNA GM;MICHAEL J. SEDDON MJ |
| 分类号 |
H01L |
主分类号 |
H01L |
| 代理机构 |
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