| 摘要 |
The present invention relates to a correcting device and, more particularly, a correcting device capable of efficiently performing a correction operation by heating the upper and lower sides of a molded wafer in a correction process. The correcting device according to the embodiment of the present invention includes a top plate which includes a first heater and a table which includes a second heater. The temperature of the first heater is higher than the temperature of the second heater. |
