发明名称 |
TOUCH PANEL AND WIRING STRUCTURE AND METHOD FOR FORMING WIRING STRUCTURE |
摘要 |
A touch panel includes a substrate, a conductive sensing layer, an insulation layer and a conductive line layer. The substrate includes a central portion and a first peripheral portion. The conductive sensing layer is disposed on the central portion. The insulation layer includes a second peripheral portion, wherein the second peripheral portion has a trench structure and is disposed on the first peripheral portion. The conductive line layer is disposed in the trench structure, and is electrically connected to the conductive sensing layer. A wiring structure and a method for forming a wiring structure are also provided. |
申请公布号 |
US2015338972(A1) |
申请公布日期 |
2015.11.26 |
申请号 |
US201514716135 |
申请日期 |
2015.05.19 |
申请人 |
Henghao Technology Co., Ltd. |
发明人 |
Wong Ching-Fang;Peng Chun-Ming |
分类号 |
G06F3/047;G06F3/041 |
主分类号 |
G06F3/047 |
代理机构 |
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代理人 |
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主权项 |
1. A touch panel, comprising:
a substrate including a first central portion and a first peripheral portion; a first conductive sensing layer disposed on the first central portion; an insulation layer including a second peripheral portion, wherein the second peripheral portion has a trench structure and is disposed on the first peripheral portion; and a conductive line layer disposed in the trench structure, and electrically connected to the first conductive sensing layer. |
地址 |
Hsinchu County TW |