发明名称 PRINTED CIRCUIT BOARD FOR MOBILE PLATFORMS
摘要 A printed circuit board for mobile platforms includes a core substrate having a first side, a ground plane covering on the first side, a first insulating layer covering the ground plane, and a plurality of first signal traces and a plurality of first ground traces, alternatively arranged on the first insulating layer, a second insulating layer connecting to the first insulating layer, and a plurality of second signal traces separated from each other, disposed on the second insulating layer, wherein the second signal traces are disposed directly on spaces between the first signal traces and the first ground traces adjacent thereto, wherein coverage of the ground plane is corresponding to disposition of the first signal trace, the first ground trace, the second signal trace and the second ground trace.
申请公布号 US2015342038(A1) 申请公布日期 2015.11.26
申请号 US201514816204 申请日期 2015.08.03
申请人 MediaTek Inc. 发明人 CHANG Sheng-Ming;LIN Shih-Chieh;CHEN Nan-Cheng
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项 1. A printed circuit board for mobile platforms, comprising: a core substrate having a first side; a ground plane covering on the first side; a first insulating layer covering the ground plane; a plurality of first signal traces and a plurality of first ground traces, alternatively arranged on the first insulating layer; a second insulating layer connecting to the first insulating layer; anda plurality of second signal traces separated from each other, disposed on the second insulating layer, wherein the second signal traces are disposed directly on spaces between the first signal traces and the first ground traces adjacent thereto, wherein coverage of the ground plane is corresponding to disposition of the first signal trace, the first ground trace, the second signal trace and the second ground trace.
地址 Hsin-Chu TW