COPPER FOIL FOR TRANSPARENT RESIN BASE MATERIAL, AND TRANSPARENT RESIN BASE MATERIAL HAVING FINE COPPER WIRING

摘要

The invention of the present application addresses the problem of providing: a copper foil for a transparent resin base material, which is suitable for use when forming, on a surface of a transparent resin base material, ultrafine copper wiring having a high scratch resistance, high resistance to dissolution in acids and a high anti-reflection effect; a transparent resin base material having fine copper wiring; and a method for producing a transparent resin base material having fine copper wiring. In order to solve this problem, as a copper foil for a transparent resin base material which is for forming copper wiring on a surface of a transparent resin base material, provided is a copper foil for a transparent resin base material which is characterized by providing a surface of a copper foil with a layer having a fine uneven structure, which contains cuprous oxide and cupric oxide and which has a fine uneven structure consisting of these complex copper compounds and formed from needle-like or plate-like protruding portions having a maximum length of 500 nm or less.