发明名称 ELECTRONIC COMPONENT DEVICE
摘要 An electronic component device includes a first electronic component on which a first electrode pad is disposed, a second electronic component on which a second electrode pad having a first pad portion and a second pad portion is disposed, a first bonding wire having one end connected to the first electrode pad and the other end connected to the first pad portion, and a second bonding wire having one end connected to a connection portion between the first pad portion and the first bonding wire and the other end connected to the second pad portion. The second electrode pad is disposed on the second electronic component so that the first pad portion and the second pad portion are laid along a direction intersecting with an extending direction of the first bonding wire. The extending direction of the first bonding wire intersects with an extending direction of the second bonding wire.
申请公布号 US2015340398(A1) 申请公布日期 2015.11.26
申请号 US201314760258 申请日期 2013.09.24
申请人 HAMAMATSU PHOTONICS K.K. 发明人 TAKAGI Shin-ichiro;ISHIHARA Shingo;MURAMATSU Masaharu
分类号 H01L27/146;H01L23/498;H01L23/00 主分类号 H01L27/146
代理机构 代理人
主权项 1. An electronic component device comprising: a first electronic component on which a first electrode pad is disposed; a second electronic component on which a second electrode pad having a first pad portion and a second pad portion is disposed; a first bonding wire having one end connected to the first electrode pad and the other end connected to the first pad portion; and a second bonding wire having one end connected to a connection portion between the first pad portion and the first bonding wire and the other end connected to the second pad portion, wherein the second electrode pad is disposed on the second electronic component so that the first pad portion and the second pad portion are laid along a direction intersecting with an extending direction of the first bonding wire, and wherein the extending direction of the first bonding wire intersects with an extending direction of the second bonding wire.
地址 Hamamatsu-shi, Shizuoka JP