| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that it is desired to shorten the time required for preprocessing that is performed before processing a wafer into a plate, and it is desired to simplify a device configuration for the preprocessing.SOLUTION: In the state where a first face 20 of a flexible sheet 12 is exposed, a second side 22 is fitted to a support surface 14 and in the flexible sheet 12, at least a substantially entire portion to be fitted to a wafer 10 is flatly supported on the support surface 14. A liquid-state adhesive 26 is given to the first face 20 of the flexible sheet 12, a first principal surface 16 of the wafer 10 is made confront the first face 20 of the flexible sheet 12, and the first principal surface 16 is brought into contact with the liquid-state adhesive 26. The flexible sheet 12 supported on the support surface 14 is rotated together with the wafer 10, the liquid-state adhesive 26 is spread over a gap 28 between the first principal surface 16 and the first face 20, the liquid-state adhesive 28 is solidified thereafter, and the flexible sheet 12 flatly supported on the support surface 14 is fixed to the first principal surface 16 of the wafer 10. |
