发明名称 |
LASER PROCESSING UNIT AND PROCESSING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing unit and a processing method which can monitor a base plate and selectively use the wave length of laser.SOLUTION: A laser processing unit 100 includes a laser part 110 which generates laser beam and diverges the laser beam; a scanner part 130 which has a plurality of scanners adjusting the advance direction of the laser beam, and provides a light path through which the laser beam passes; a guide part 120 which is provided between the laser part 110 and the scanner part 130, and selectively guides the diverged laser beam to the scanner; an irradiation part 140 which irradiates a base plate with the laser beam having passed through the scanner part 130; and a photo part 150 which takes a picture of the base plate. |
申请公布号 |
JP2015211982(A) |
申请公布日期 |
2015.11.26 |
申请号 |
JP20150052099 |
申请日期 |
2015.03.16 |
申请人 |
CHARM ENGINEERING CO LTD |
发明人 |
KIM JOON RAE;LEE KEUN HAENG;JEE YOUNG SU |
分类号 |
B23K26/351;B23K26/067;B23K26/082 |
主分类号 |
B23K26/351 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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