发明名称 |
METHOD FOR MANUFACTURING HEAT CONDUCTING SUBSTRATE |
摘要 |
A method for manufacturing a heat conducting substrate includes providing a metal plate with a first surface and an opposed second surface; forming a plurality of micro bumps on the first surface; disposing an adhesive layer on the first surface among the micro bumps; providing a circuit layer with a plurality of first openings formed thereon, positions of the first openings corresponding to positions of the micro bumps; fixing the circuit layer onto the adhesive layer, wherein the micro bumps are exposed through the first openings respectively; manufacturing circuits on the circuit layer; and finally, thinning a thickness of the metal plate. The method for manufacturing a heat conducting substrate has the manufactured heat conducting substrate to meet the requirements of being thin-shaped and having high heat conducting electronic elements, and has the advantage of an improved yield. |
申请公布号 |
US2015342058(A1) |
申请公布日期 |
2015.11.26 |
申请号 |
US201514699598 |
申请日期 |
2015.04.29 |
申请人 |
Lighten Corporation |
发明人 |
YANG Cheng-Tao |
分类号 |
H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a heat conducting substrate, comprising:
providing a metal plate with a first surface and an opposed second surface; forming a plurality of micro bumps on the first surface; disposing an adhesive layer on the first surface among the micro bumps; providing a circuit layer with a plurality of first openings formed thereon, positions of the first openings corresponding to positions of the micro bumps; fixing the circuit layer onto the adhesive layer, wherein the micro bumps are exposed through the first openings respectively; and manufacturing circuits on the circuit layer. |
地址 |
Zhongli City TW |