发明名称 POLISHING PAD, POLISHING METHOD USING THE POLISHING PAD, AND USING METHOD OF THE POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad which enables simple polishing by eliminating or reducing as short as possible pre-polishing time, effective and highly reliable polishing by performing polishing continuously with excellent polishing speed from the beginning stage, and includes a resin foaming body made of thermoplastic resin that is excellent in repolishing performance.SOLUTION: Polishing pads 1, 2 are constituted of highly-rigid thermoplastic hard resin foaming body which includes plural cells and a three-dimensional cell structure constituted by partitioning the cells through cell walls to have mutually-independent partitions. The polishing pad is a structural body in which the tensile strength is 50 MPa to 90 MPa, the bending strength is 90 MPa to 140 MPa, both of minimum values of the tensile modulus of elasticity and bending modulus of elasticity are equal to or more 2400 MPa, the average cell diameter is 4 μm to 50 μm, the average cell wall thickness is 1 μm to 5 μm, and the ratio of the average cell diameter to the average cell wall thickness is 4 to 10.
申请公布号 JP2015211993(A) 申请公布日期 2015.11.26
申请号 JP20140095533 申请日期 2014.05.02
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 YOKOTA NOBUTOSHI;YAMAMOTO SHUNJI;KUBOTA TETSUJI;TODA SADAYUKI;MASUDA MITSUO
分类号 B24B37/24;B24B1/00;B24B37/00;C03C19/00;G11B5/84;H01L21/304 主分类号 B24B37/24
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