| 摘要 |
PROBLEM TO BE SOLVED: To transfer a useful layer onto a support substrate, the useful layer having a periodic pattern of thickness variation, the size of which is reduced.SOLUTION: A method for transferring a useful layer onto a support substrate includes the steps: formation of a weakened plane 2 through the implantation of light species into a first substrate 1 in such a way as to form a useful layer 3 between the weakened plane 2 and a surface of the first substrate 1; application of a support 4 onto the surface of the first substrate 1 to form an assembly 5 to be fractured having two exposed sides (S1, S2); thermal weakened treatment of the assembly 5 to be fractured; and initiation and self-sustained propagation of a fracture wave in the first substrate 1 along the weakened plane 2. At least one of the sides S1, S2 of the assembly 5 to be fractured is in close contact, over a whole contact zone, with absorbent elements 6a, 6b suitable for capturing and dissipating acoustic vibrations emitted during the initiation and/or propagation of the fracture wave. |
