SLIM LED PACKAGE

摘要

Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.

主权项

1. A light emitting diode (LED) package, comprising:
a first lead frame and a second lead frame separated from each other; an LED chip disposed on the first lead frame and electrically connected with the second lead frame; and a resin covering at least portions of surfaces of the first and second lead frames, wherein: at least one of the first and second lead frames comprises a first side facing the other lead frame and a second side opposite the first side; and at least one of the first and second lead frames comprises a first groove disposed on a lower surface thereof and adjacent the first side, and a second groove disposed on the lower surface thereof and adjacent the second side.