| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer frame with a polymer matrix, achieving reduced size in a package, shortening a connection length to the outside, and having reduced cost and increased reliability, and a method of fabrication.SOLUTION: An array of chip sockets 12 is defined by an organic matrix framework 16 surrounding sockets 12 passing through the organic matrix framework 16 and further comprising a grid of metal vias 14 passing through the organic matrix framework 16. A panel includes an array of chip sockets 12, and each chip socket 12 is surrounded and defined by an organic matrix framework 38 including a grid of copper vias 14 passing through the organic matrix framework 16. The panel includes at least a first region with sockets 12 having a set of dimensions for receiving one type of chip 35 and a second region with sockets 12 having another set of dimensions for receiving another type of chip 35. |
