发明名称 CONTROL METHOD FOR PROCESS LIQUID FOR THINNING RESIN LAYER
摘要 PROBLEM TO BE SOLVED: To provide a control method for a process liquid for thinning a resin layer in a method of reducing a film thickness of a photosensitive resin layer by use of a process liquid for thinning a resin layer, in which an ability of reducing a film thickness of the process liquid for thinning a resin layer, which is an alkaline aqueous solution having a high concentration, can be more stably maintained at a given level.SOLUTION: The control method for a process liquid for thinning a resin layer is applied to a method of reducing a film thickness of a photosensitive resin layer, which includes steps of forming a photosensitive resin layer on a substrate surface and a step of reducing a film thickness of the photosensitive resin layer by use of the process liquid for thinning a resin layer, in this order. In the control method, the following methods are used together: a method of replenishing the process liquid with a given amount of a first replenisher in accordance with an amount of processed substrates; and a method of determining a fatigue degree of the process liquid for thinning a resin layer by a neutralization titration method, and replenishing the process liquid with a second replenisher so as to maintain the ability of the process liquid for thinning a resin layer to a predetermined range.
申请公布号 JP2015212754(A) 申请公布日期 2015.11.26
申请号 JP20140095057 申请日期 2014.05.02
申请人 MITSUBISHI PAPER MILLS LTD 发明人 KAWAI NOBUYUKI;TOYODA YUJI;GOKAN HIROHIKO;NAKAGAWA KUNIHIRO
分类号 G03F7/38;H05K3/06;H05K3/18;H05K3/28 主分类号 G03F7/38
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