发明名称 INTERCONNECTION ARCHITECTURE FOR MULTILAYER CIRCUITS
摘要 A computer readable memory includes a circuit layer, a multilayer memory stacked over the circuit layer to form a memory box, the memory box comprising a bottom surface interfacing with the circuit layer and four side surfaces, and a first switching crossbar array disposed on a first side of the memory box. A plurality of vias connects the circuit layer to the first switching crossbar layer. The first switching crossbar array accepts signals from the plurality of vias and selectively connects a crossbar in the multilayer memory to the circuit layer. A method for addressing multilayer memory is also provided.
申请公布号 EP2946385(A1) 申请公布日期 2015.11.25
申请号 EP20130871450 申请日期 2013.01.18
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 ROBINETT, WARREN
分类号 G11C5/02;G11C5/06;G11C7/18;G11C8/10;G11C8/12;G11C8/14;G11C13/00 主分类号 G11C5/02
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