发明名称 THERMAL MITIGATION IN DUAL SUBSCRIPTION DUAL ACTIVE DEVICES
摘要 A system, a method and an apparatus are described. The apparatus includes a modem that responds to a thermal mitigation request by invoking different levels of thermal mitigation for different concurrently active connections. In some instances, the modem may invoke thermal mitigation with respect to a first active connection and refrain from invoking thermal mitigation with respect to a second active connection maintained by the modem. The apparatus determines the first and second active connections based on subscriptions corresponding to subscriber identification modules, an identification of a power amplifier or group of power amplifiers responsible for a thermal issue in the modem. The selection of mitigation levels for each active connection and decisions to invoke mitigation on one connection while refraining from invoking mitigation on another connection may be based on priorities of the active connections, including quality of service related priorities.
申请公布号 EP2946262(A2) 申请公布日期 2015.11.25
申请号 EP20140717380 申请日期 2014.03.17
申请人 QUALCOMM INCORPORATED 发明人 NGAI, FRANCIS;DERBYSHIRE, AMY;ALTON, RONALD;MAHAJAN, AMIT;MCCLOUD, MICHAEL;SHAHIDI, REZA;BANDARU, SRIDHAR;GAONEKAR, ASHISH
分类号 G06F1/20;G06F9/48;H04W52/02 主分类号 G06F1/20
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