发明名称 Housing arrangement of a power electronics device
摘要 A housing arrangement of a power electronics device, comprising one power module or several identical power modules (M L1 ...M W1 ), each module with at least one part connected to a hazardous voltage, the arrangement further comprising a housing part (6) having room for at least one power module (M L1 ...M W1 ). Each power module comprises an enclosure part (5, 10) which essentially surrounds the power module (M L1 ...M W1 , M U1 ) and comprises electrically insulating material. All the external connections of the power module are placed on one single wall of the enclosure part (5, 10). The power modules (M L1 .. M W1 , M U1 ) and the enclosure part (5, 7) of the power modules are arranged such that when the power module (M L1 ...M W 1, M U1 ) is installed to the housing part (6) the power module (M L1 ...M W1 , M U1 ) is electrically insulated from the housing part (6) and external connections of the power module (M L1 ...M W1 , M U1 ) are directed to the front side of the housing part.
申请公布号 EP2947764(A1) 申请公布日期 2015.11.25
申请号 EP20140169592 申请日期 2014.05.23
申请人 VACON OYJ 发明人 DILLEY, DEVIN;HOFFMAN, MARC;ISAKSSON, DAN
分类号 H02M7/00 主分类号 H02M7/00
代理机构 代理人
主权项
地址