发明名称 加熱装置、基板処理装置、及び半導体装置の製造方法
摘要 <p>PROBLEM TO BE SOLVED: To suppress shearing of a holder due to thermal deformation of a heat generating body while suppressing a shift of the heat generating body.SOLUTION: A heating device comprises: a heat generating body which is formed zigzag through connection of a plurality of mountain parts and valley parts alternately and has both fixed ends; holder reception parts provided at ends of the valley parts respectively and formed as cut parts having wider width than that of the valley parts; a heat insulator provided at an outer circumference of the heat generating body; and holders arranged in the holder reception parts and fixed to the heat insulator.</p>
申请公布号 JP5824082(B2) 申请公布日期 2015.11.25
申请号 JP20140020250 申请日期 2014.02.05
申请人 发明人
分类号 H01L21/324;C23C16/46;F27B5/14;F27D11/02;H01L21/205;H01L21/22;H05B3/06 主分类号 H01L21/324
代理机构 代理人
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