| 摘要 |
Embodiments of the present invention disclose a thermal pad, a method for fabricating a thermal pad, a heat dissipating apparatus, and an electronic device. The thermal pad includes: a thermally conductive sheet-like substrate, where the sheet-like substrate has a compressible porous mesh structure in a thickness direction; and a thermally conductive coating, where the coating is formed of a flexible organic compound, and the organic compound fills inside the sheet-like substrate or is coated on a surface of the sheet-like substrate, or the organic compound both fills inside the sheet-like substrate and is coated on the surface of the sheet-like substrate. In the thermal pad, the method for fabricating a thermal pad, the heat dissipating apparatus, and the electronic device provided in the embodiments of the present invention, a thermally conductive flexible organic compound fills inside or is coated on a thermally conductive sheet-like substrate having a compressible porous mesh structure in the thickness direction, so that the formed thermal pad has high thermal conductivity as well as shigh compressibility, and therefore can improve heat dissipation performance of the electronic device. |
