Method and apparatus for separating semiconductor devices from a wafer

摘要

An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.

主权项

1. A method for separating semiconductor devices from a wafer, the method comprising:
arranging semiconductor devices on a carrier, the carrier including at least a thermo-release foil, and removing a plurality or all of the semiconductor devices from the carrier using a gas jet.